FEATURES:

• Works with all new types og BGA's to quickly and efficiently place new solder balls on a working BGA component. One rework cycle can be completed in minutes.
  
  
• Flexible designs allows for use with all types of BGA components. Unique BGA designs can have stencils made to order.
  
  
• After placing the solder balls, we recommend placing the component on Xytronic's Preheat System 628 set for few minutes to secure the balls in a their proper position..